Support substrate for wafer bonding
A support substrate for wafer bonding with high thermal conductivity, close to the thermal expansion coefficient of semiconductor materials!
We handle "support substrates for wafer bonding." Starting with "pure Mo," which is suitable for power applications requiring high output and high reliability, we also offer "Cu-Mo," which is easy to roll and press, and "Cu-W," which combines the low thermal expansion of W with the high thermal conductivity of Cu. It boasts a thermal expansion coefficient close to that of semiconductor materials and high thermal conductivity. 【Features】 ■ For wafer bonding ■ High thermal conductivity ■ Close to the thermal expansion coefficient of semiconductor materials *For more details, please refer to the PDF document or feel free to contact us.
- Company：アライドマテリアル 営業企画部
- Price：Other
